International Conference on Advances in Materials Processing and characterization (AMPC-2020)
The purpose of this Inter-disciplinary conference is to offer a forum for academicians, scientists and engineers working in the area of Materials Science and Engineering / Materials Processing/Characterization and allied areas related to Engineering materials, to present and review the state-of the-art developments on all aspects related to the processing and characterization of Engineering materials. The topics of AMPC 2020 give a wide scope to the research community belonging to Material science and Engineering, Metallurgical Engineering, Mechanical Engineering and other related interdisciplinary branches.
​Conference Topics:
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Biomaterials, Polymers , Ceramics
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Composite Materials
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Smart Materials
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Nanostructured Materials
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Material Joining processes
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Micro-fabrication/molding
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Material Forming
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3D Printing/ Additive Manufacturing
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Nano Fabrication
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Heat Treatment of Materials
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Powder Processing Science/Sintering Technologies
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Innovative Materials Processing
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Machining of Newer Materials
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Thin films and coating Technology
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Finite Element Analysis in Materials Design and Processing
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Failure and Fracture Mechanics
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Materials Engineering for bio-medical applications
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Advanced materials evaluation techniques (SEM, TEM, XRD, EDAX, dimensional and Chemical surface scanning, AFM, DMA, etc.)
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Non-Destructive Evaluation
​Abstract/Full Paper Submission:
The abstract ( 300 words) must carry sufficient information for fair assessment and should contain the following:
Full title of the Paper, Name of author(s), affiliation and full address with telephone numbers, fax numbers and e-mail ids, Keywords, A brief summary of the research paper
The abstract can be submitted online here: https://www.mypadnow.com/ampc2020/ampc2020---call-for-paper?cplid=10&parent=#
After provisional acceptance of the abstract, the full paper will be peer-reviewed before final acceptance for oral and poster presentation. Each paper will be subjected to plagiarism check. The guidelines for preparing a camera-ready paper will be provided along with the provisional acceptance letter.
Conference Fee: (Early Bird/Late)
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Research Scholars/ Students: INR3000/INR5000
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Authors from Academia: INR5000/INR7000
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Delegates from Industry: INR8000/INR10000
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Foreign delegates: USD400/USD500
Important Dates:
Last Date for Abstract Submission: Thursday Apr 30, 2020 - 11 : 59 pm
Intimation to authors: Tue May 5, 2020 - 11 : 59 pm
Last Date for Final Submission: Tue Jun 30, 2020 - 11 : 59 pm
Camera Ready: Thu Aug 20, 2020 - 11 : 59 pm
Registration till: Thu Aug 20, 2020 - 11 : 59 pm
Venue: Anna University, CEG Campus, Chennai India
Contact:
Prof.S.Balasivanandha Prabu/
Prof.V.S.Senthil Kumar
Organizing Secretaries, AMPC2020
Department of Mechanical Engineering
College of Engineering Guindy Campus
Anna University, Chennai-600025, INDIA
E-mail:ampc2020@annauniv.edu; ampc2020au@gmail.com
Technical Support:
Email: support@mypadnow.com
Whatsapp/Mobile: +91.9944050600
For more information on Registration dates, Topics of the conference, Abstract and Full Paper submission, Conference Fees and other details click on the "Website/Brochure" button below.
About Anna University, CEG Campus, Chennai
College of engineering Guindy was started in the year 1794. It was the first engineering college in India. Now College of Engineering, Guindy is the largest engineering college in Tamil Nadu . Situated in the southern part of Chennai city, the campus extends over 100 hectares abutting the Adyar River on the north and Raj Bhavan on the south.
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